Power chips are attached to external circuits with packaging, and their efficiency depends upon the support of the packaging. In high-power scenarios, power chips are usually packaged as power modules. Chip affiliation describes the electric link on the top surface area of the chip, which is typically aluminum bonding cord in conventional components. ^
Traditional power component package cross-section
Today, commercial silicon carbide power modules still primarily make use of the product packaging innovation of this wire-bonded typical silicon IGBT module. They face issues such as big high-frequency parasitical specifications, not enough warmth dissipation capacity, low-temperature resistance, and not enough insulation toughness, which restrict making use of silicon carbide semiconductors. The display of outstanding performance. In order to address these issues and completely exploit the big potential benefits of silicon carbide chips, several new packaging modern technologies and remedies for silicon carbide power modules have actually emerged recently.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have created from gold wire bonding in 2001 to aluminum wire (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have developed from gold cables to copper cords, and the driving force is expense reduction; high-power gadgets have developed from light weight aluminum wires (strips) to Cu Clips, and the driving pressure is to enhance item performance. The greater the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that uses a strong copper bridge soldered to solder to link chips and pins. Compared with conventional bonding packaging approaches, Cu Clip technology has the complying with benefits:
1. The link in between the chip and the pins is constructed from copper sheets, which, to a particular degree, changes the typical cable bonding approach in between the chip and the pins. For that reason, an one-of-a-kind bundle resistance value, higher current circulation, and better thermal conductivity can be acquired.
2. The lead pin welding location does not need to be silver-plated, which can totally conserve the cost of silver plating and inadequate silver plating.
3. The item appearance is entirely consistent with typical items and is mainly made use of in web servers, portable computers, batteries/drives, graphics cards, motors, power materials, and various other areas.
Cu Clip has 2 bonding techniques.
All copper sheet bonding approach
Both the Gate pad and the Source pad are clip-based. This bonding approach is extra costly and complicated, but it can achieve better Rdson and far better thermal results.
( copper strip)
Copper sheet plus wire bonding method
The resource pad utilizes a Clip technique, and the Gate makes use of a Wire method. This bonding technique is a little cheaper than the all-copper bonding technique, conserving wafer area (suitable to very little entrance locations). The process is less complex than the all-copper bonding method and can obtain much better Rdson and much better thermal result.
Supplier of Copper Strip
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